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    KLT-LSC激光蓝宝石全切割机
    Laser Sapphire Full-Cutting Machine
    商品货号:ECS002825
    商品品牌:北京超立方科技公司
    PDF 文档: DownloadKLT-LSC激光蓝宝石全切割机details Document
    详细介绍
    KLT-LSC激光蓝宝石全切割机
    Laser Sapphire Full-Cutting Machine
    1.Description(描述)
    This machine is a laser sapphire glass full-cutting machine to be processed with a precise laser beam in the field of camera lens and touch ID, and the touch windows of Mobile Phone/PMP, Tablet PC, etc Flat Display products.
    This laser sapphire full-cutting machine has the best method with high speed and accuracy, especially the small chip for outline and hole/slot cutting, comparing to the other processing methods.
    This laser full-cutting has many merits of high efficiency, high throughput, less utilizing fee with less components exchange.
    2.Feature(特色)
    Ø Apply full-cutting for every sapphire glass wafer worldwide.
    Ø High quality cut various shapes, small chipping size by no touch processing.
    Ø Low machine maintenance and utilizing fee by no tool changes, lubricating oils.
    Ø Short preparation time for the machine operation and simple operation.
    Ø A IR fiber laser with Min. 30μm spot size is used, with considerably stable beam quality.
    Ø The machine is equipped with various functions involving the exclusive software and
    Ø controller to be effectively processing any contours cutting.
    Ø The machine has high positioning accuracy at 1μm and high speed processing at 100mm/sec.
    Ø The machine is easy accessible for quick trouble-shooting, since it is composed with all standard components.
    Ø The machine has exhaust, vacuum, fixture, etc, various equipments for the micro laser processing and sapphire/glass positioning without any scratches.
    Ø The automatic laser full-cutting machine can be supplied with the proper jig/fixture to be fixed by any various mother sapphire glass wafer size, and loading/unloading tools of robot mechanism and CCD vision system as an option of high throughput.
    3.Configuration(配置)
    Ø Standard machine; Manual loading/unloading
    -Automatic loading/unloading system (Option)
    -CCD vision system (Option)
    Ø Standard Sapphire Glass Wafer Size4inch
    Ø Sapphire glass thicknessFrom 0.15mm
    4.Specification(规格)
        Laser resonator
    X-Y axis movement
        Laser typeFiber laser
        Laser power150W
        Laser peak powerMax. 1.5KW
        Laser sport beam sizeMin. 30um
        Laser beam modeTEM00
        Laser wavelength1070nm
        Pulse width0.2ms
        Q- Switch
        Machine environment
    -Temperature15-30 Deg. C
    -Humidity30%-70%
        Linear stage
        Working area150 X 200mm
        Transfer speed100mm/sec
        Accuracy+/-1um
        Repeated accuracy+/-1um
     
    Z axis movement
        Ball Screw & LM Guide
        Stroke60mm
        Accuracy+/-10um
     
    商品标记

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