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    LAP2000 Laser Processing Tool
    Laser Processing Tool
    商品货号:ECS002680
    商品品牌:Optec
    PDF 文档: DownloadLAP2000 Laser Processing Tooldetails Document
    详细介绍
    LAP2000 Laser Processing Tool
    LAP2000 Laser Ablation and Patterning tool for non-contact drilling, milling of technical polymers and medical products, laser lift-off (LLO).
    规格
    • 激光类型 准分子(供应商和型号可?。?/div>
    • 工作波长 248nm(193nm可?。?/div>
    • 脉冲能量 可达700mJ
    • 重复频率 可达200Hz
    • 目标能量密度 0.5-5J/cm2
    • XY移动 300×300mm
    • XY速度 100mm/s
    • 分辨率 1mm
    特性
    • 激光烧蚀清除聚合物不损失金属或基底
    • 激光光斑分布均匀
    • 计算机选择烧蚀部分或加工区域
    • 兼容CAD
    • 高效排烟
     
    KEY FEATURES
    • Clean removal of polymer layers by laser ablation with no damage to metallization or      substrate
    • Large area super-uniform beam
    • PC selection of ablation motif/process area (MRA)
    • Linear motor X,Y stages with PSO for FOTF (Fire-on-the-fly) operation
    • Autoalign functions
    • CAD compatible
    • Efficient fume extraction
     
    APPLICATIONS
     
    • Trimming of electronics packaging/contact cleaning,
    • Laser Lift-Off for GaN
    • Flat panel display/OLED
    • Waveguide milling
    • Surface treatments
     
    MACHINE SPECIFICATIONS
     
     Laser Type:                               Excimer, choice of suppliers & models
    Operating Wavelength                248nm (193nm option)
    Pulse Energy                             up to 700mJ
    Repetition rate                              up to 200Hz
    On-target e.d.                           typically 0,5-5J/cm², depending on process
           Motifs                                Choice of PC driven motif selectors and/or MRA
           Process field                   Up to 8x8mm
    Part Holding                            Vacuum chuck and/or wafer clamps
    Environment                             Fume extractor/filter
    X,Y machining area                          300x300mm(other sizes available on option)
    Speed/position resolution              100mm/s, 1µm linear drive stages with PSO option
    Theta stage option                     360° full rotation or +/-3° auto-trim stage options
    Focus depth/part height(Z axis)    0-50mm
    CCTV inspection                       Offset détented zoom, 45-300X; image acquisition, TTL
           Control Software                   ProcessPower multi-level access user-friendly interface with set-up & CAD conversion routines, auto-align functions & videa measuring cursor
    商品标记

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